1、Bidding Conditions
Overview:Thin glue leveling and developing machine
Source of Funds:Prepared
Description of The Prepared Bidding Conditions:Prepared
2、Bidding Content
Bidding No:0664-2540SUMECF08/03
Project Name:Thin glue leveling and developing machine
Place of Implementation:Bengbu city
List of Products:
| NO. | Product Name | Quantity | Main Technical Data | Remarks |
| 1 | Thin glue leveling and developing machine | 2 | Please refer to the bidding documents for details |
3、Qualification Requirements For Bidder
Qualifications or Performance:More details in the Chinese version of the tendering document
Joint Bids:NOT Available
Bid without the bidding documents:NOT Available
4、Acquisition of Bidding Documents
Beginning of Selling Bidding Documents:2025-05-09
Ending of Selling Bidding Documents:2025-05-20
Sell bidding？doc？online？or？not:No
To Obtain::On-site Purchase
Place:More details in the Chinese version of the tendering document
Price of Bidding Documents:￥2000/$275
Additional Instructions:More details in the Chinese version of the tendering document
5、Bid Submission
Deadline for Submitting Bids/Time of Bid Opening (Beijing Time):2025-06-04 09:30
Place of Bid:More details in the Chinese version of the tendering document
Place of Bid Opening:More details in the Chinese version of the tendering document
6、Contact Details
Purchasers:Anhui Huaxin Weina Integrated Circuit Co., Ltd.
Add.:Bengbu city
Contact:Mr He
Tel:18851776509
Bidding Agency:SUMEC INTERNATIONAL TECHNOLOGY CO., LTD.
Add.:Nanjing city
Contact:Jiangyuefeng/Zhuzhiyun/Zhoucui
Tel:18551719296、025-84531056
7、Remittance Approach:
Bank(RMB):
Bank(USD):
Account NO.(RMB):
Account NO.(USD):
